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PWB Printed Circuit Board Assembly High CTI Material For Electronic Device Application

PWB Printed Circuit Board Assembly High CTI Material For Electronic Device Application

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Brand Name :ACCPCB
Model Number :P1221
Certification :ISO,UL,SGS,TS16949,ROHS
Place of Origin :China
MOQ :1 PCS
Price :Negotiable
Payment Terms :T/T / Western Union / Paypal
Supply Ability :35,000SQ.M/Per Month
Delivery Time :6-10days
Packaging Details :Vacuum Packing With Desiccant
Finish thickness :1.60±10%mm
Minimum via dia :0.2mm
Surface Finish :Immersion gold
Material :ITEQ FR4
Application :Medical sphygmomanometer
Solder mask :Red
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PWB Printed Circuit Board Assembly High CTI Material for Electronic Device Application

Our PCB order capability:

Layer :

up to 20 layers

Materials : FR-4, FR4 High Tg/ High CTI Material
TG :

130-180

Surface :

HASL LF , Immersion Gold/Silver/Tin, OSP, Gold Plated

Min drill size : 0.10mm
Min track/spacing :

4/4-mil

Buried and blind via : 0.15MM
Outline :

CNC Milling and V-cut

Solder mask colors : Green, Blue, Black, White, Red and Yellow, Matte green, Matte black, Matte Blue
Silkscreen colors :

black, white and yellow

Impedance control

yes

Blue Peelable Mask

yes
Company type: Manufacturer/ Factory
Outline: Routing,V-Groove, Beveling punch

Main Export Markets:

  • Asia
  • Australasia
  • Central/South America
  • Eastern Europe
  • Mid East/Africa
  • North America
  • Western Europe

Shipping Information :

FOB Port : Hong Kong / Shenzhen

Lead Time : 6-10 days

HTS Code : 8534.00.10

Dimensions Per Carton : 37X27X22 cm

Weight Per Carton : 20 Kilograms

FAQ:
1. What kinds of boards can ACCPCB process?

Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.


2. What data are needed for PCB production?

PCB Gerber files with RS-274-X format.


3. What’s the typical process flow for multi-layer PCB?

Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.


4. How many types of surface finish ACCPCB can do?

the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.

5. How do ACCPCB ensure quality?

Our high quality standard is achieved with the following.

1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process

PWB Printed Circuit Board Assembly High CTI Material For Electronic Device Application

China PWB Printed Circuit Board Assembly High CTI Material For Electronic Device Application for sale

PWB Printed Circuit Board Assembly High CTI Material For Electronic Device Application

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