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Professional Fast Quick Turn Prototype PCB Fabrication KB FR4 2.0mm board thickness

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Accuracy Electronics Technologies Co.,Ltd
City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:MrsPauline gao
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Professional Fast Quick Turn Prototype PCB Fabrication KB FR4 2.0mm board thickness

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Brand Name :ACCPCB
Model Number :S1021
Certification :ISO,SGS,TS16949
Place of Origin :China
MOQ :1 PCS
Price :Negotiable
Payment Terms :T/T ,Western Union,Paypal
Supply Ability :50000SQ.M/Per Month
Delivery Time :3-5days
Packaging Details :Vacuum packing
Material :KB FR4
Count :Four Layer
Surface Finish :Gold Flash
Usage :water meter
Solder Mask :Green
Copper thickness :1.5 oz all layer
Board thickness :1.6mm
Min. hole size :0.1mm
Min. line spacing :0.1mm4mil)
Min. line width :4mil
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Professional Fast Quick Turn Prototype PCB Fabrication KB FR4 2.0mm board thickness

Production description :

this board is 4layer with 1.5oz copper thickness. it is used on high voltage equipment. PCB prototype,small volum, middle and large volume are accepted. no MOQ request for new boards. for repeat order, just meet 3sq.m.

Key Specifications/Special Features:

Number of layers: Mulity Layer / Four layer
Base material:

KB FR4

Copper thickness: 1.5 oz Cu in all layer
Thickness: 1.60 mm
Size:

150 x 90 mm

Cooper In holes:

min 20um

Surface finishing:

Gold Flash

Solder mask:

LPI solder mask, peelable solder mask

Solder mask:

Green

Working panel size : max:1200mmX600mm (47'' X24'')
Outline profile: Punching, Routing , CNC routing + V-cut
Certificate : UL, CQC, TS16949, ISO14000, ROHS
Silkscreen color : White
Twist and Bow : no more than 0.75 %

PCB Flow Chart.pdf

Rigid PCB Technical Capability:

Items Technical Capability
Layers 1-28 layers Min. line width/space 4mil

Max.board size (single&doule

sided)

600*1200mm Min.annular ring width: vias 3mil
Surface finish

HAL lead free,gold flash

Immersion silver,Immersion gold ,Immersion Sn,

hard gold,OSP,ect

Min.board thickness(multilayer) 4layers:0.4mm;
6layers:0.6mm;
8layers:1.0mm;
10layers:1.20mm
Board materials

FR-4; high Tg; high CTI; halogen free; high frequency(rogers,taconic,

PTFE,nelcon,

ISOLA,polyclad 370 HR); heavy copper,

Metal base clade laminate

Plating thickness (Technique:

Immersion Ni/Au)

Plating type: Imm Ni, Min./Max thickness:100/150U'' Plating type: Imm Au, Min./Max thickness:2/4U''
Impedance control ± 10%

Distance between

line to board edge

Outline: 0.2mm

V-CUT: 0.4mm

Base copper thickness(Inner

and outer layer)

Min. thickness: 0.5 OZ Max.thickness: 6OZ Min.hole size(board thickness ≥2mm) Aspect ratio≤16
Finished copper thickness Outer layers:
Min.thickness 1 OZ,
Max.thickness 10 OZ
Inner layers:
Min.thickness :0.5OZ,
Max.thickness : 6 OZ
Max.board thickness(single&doule sided) 3.20mm

Products Application:

Our products are widely used in meter, medical, solar energy, mobile, communication, industrial control, power electronics,security, consuming, computer, automotive, aerospace, military and so on.

Professional Fast Quick Turn Prototype PCB Fabrication KB FR4 2.0mm board thickness

FAQ:
1. What kinds of boards can ACCPCB process?

Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.

3. What data are needed for PCB production?

PCB Gerber files with RS-274-X format.


4. What’s the typical process flow for multi-layer PCB?

Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.

5. How do ACCPCB ensure quality?

Our high quality standard is achieved with the following.

1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process

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