Accuracy Electronics Technologies Co.,Ltd
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Immersion Gold Blank PCB Board Black Solder Mask Micro Section For Pose Machine
Production description :
this board is 8layer PCB it is used on POS machines production. PCB prototype,samll volum, middle and large volume are accepted. no MOQ request for new boards.
| Layer No. | 8L |
| Material : | FR4 |
| Finish thickness : | 1.20 ±10%mm |
| Minimum width/spacing : | 0.1MM |
| Minimum via dia : | 0.2MM |
| Surface finish : | immersion god |
| Immpedance : | 50ohm |
| Legends : | White |
| Certification : | ISO UL ROHS SGS |
| Base copper thickness: | 0.5oz-6oz |
| min space between hole to track: | 0.15mm |
| copper thickness in hole: | 0.02-0.035mm |
| Aspect ratio: | 10:1(max) |
| Solder mask : | LPI solder mask , Peelable mask |
| min solder mask window: | 0.05mm |
| impedance control: | +/-10% |
ACCPCB Technical Capability.pdf
Advantages:
▪ No MOQ, 14 years of PCB turnkey services
▪ Quick turn, prototype, low & medium & high volume
▪ OEM services provide
▪ ISO 9001-, ISO 14001-, ISO/TS16949, ISO 13485, IATF16949, OHSAS18001 certified
▪ 100% E-test, visual, AOI inspection, including X-ray, 3D microscope
▪ Fast response within 24 hours
FAQ :
1. How do ACCPCB ensure quality?
Our high quality standard is achieved with the following.
1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process
2. What kinds of boards can ACCPCB process?
Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.
3. What data are needed for PCB production?
PCB Gerber files with RS-274-X format.
4. What’s the typical process flow for multi-layer PCB?
Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.
5. How many types of surface finish ACCPCB can do?
the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.
6. What are the main factors which will affect the price of PCB?
Material;
Surface finish;
Board thickness, Copper thickness;
Technology difficulty;
Different quality criteria;
PCB characteristics;
Payment terms;