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Impedance Control PCB OEM Service Fully Inspected ROHS Comply multilayer pcb manufacturing

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Accuracy Electronics Technologies Co.,Ltd
City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:MrsPauline gao
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Impedance Control PCB OEM Service Fully Inspected ROHS Comply multilayer pcb manufacturing

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Brand Name :ACCPCB
Model Number :P1086
Certification :ISO, UL, SGS,TS16949
Place of Origin :China
MOQ :1-5PCS
Price :Negotiable
Payment Terms :L/C / T/T / Western Union / Paypal
Supply Ability :30,000SQ.M/PER MONTH
Delivery Time :12-16days
Packaging Details :Vacuum packaging
Material :KBFR4
Pcb :Customized PCB factory
Product name :100ohm impedance controlled PCB
Min. hole size :0.2mm
Surface finishing :LEAD FREE HAL
Copper thickness :0.5 OZ--2.0OZ
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Impedance Control PCB OEM Service Fully Inspected ROHS Comply multilayer pcb manufacturing

Key Specifications/Special Features :

Base Material :FR4TG180
Board Thickness :0.8 mm
Layers :2-20 layers
Copper thickness :2 OZ In all layer
Surface Finish :ENIG
Tolerance :+/-0.01mm
Impedance :100Ohm
Min. Hole Size :0.20mm
Min. Line Width :0.1mm/4mil
Min. Line Spacing :4/4mil(0.1/0.1mm)
Capacity of Production :50000Sq.m/month
Certificate:Certificate:
Company type:Manufacturer/ Factory


Quality assurance :
Every production process has a special person to test to ensure quality, AOI, E-testing, Flying Probe Test.
Have professional engineers to check the quality
All products have passed CE, FCC, ROHS and other certifications

Technology Capability:

ItemTechnical Parameters
Layers1-28 Layers
Inner Layer Min Trace/Space4/4 mil
Out Layer Min Trace,Space4/4 mil
Inner Layer Max Copper4 OZ
Out Layer Max Copper4 OZ
Inner Layer Min Copper1/3 oz
Out Layer Min Copper1/3 oz
Min hole size0.15 mm
Max.board thickness6 mm
Min.board thickness0.2mm
Max.board size680*1200 mm
PTH Tolerance+/-0.075mm
NPTH Tolerance+/-0.05mm
Countersink Tolerance+/-0.15mm
Board Thickness Tolerance+/-10%
Min BGA7mil
Min SMT7*10 mil
Solder mask bridge4 mil
Solder mask colorWhite,black,blue,green,yellow,red,etc
Legend colorWhite,black,yellow,gray,etc
Surface finishHAL,OSP, Immersion Ni/Au ,Imm silver/SN,ENIG
Board materialsFR-4;high TG;HighCTI; halogen free; Aluminum Bsed PCB,high frequency(rogers,isola),copper -base PCB
Impedance control+/-10%
Bow and twist≤0.5


Application:
Widely used in stage, Industrila control,computer,consuming electronics,security,automotive,power electronics,medical,telecom etc.

Lead Time :

Lead Time2 /L4 /L6/ L8/ L
Sample Order3-5days6-8days10-12days12-14days
Mass Production7-9days8-10days12-15days15-18days

FAQ :
1. How do ACCPCB ensure quality?
Our high quality standard is achieved with the following.
1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process
2. What kinds of boards can ACCPCB process?
Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.
3. What data are needed for PCB production?
PCB Gerber files with RS-274-X format.
4. What’s the typical process flow for multi-layer PCB?
Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.
5. How many types of surface finish ACCPCB can do?
the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.
6. What are the main factors which will affect the price of PCB?
Material;
Surface finish;
Board thickness, Copper thickness;
Technology difficulty;
Different quality criteria;
PCB characteristics;
Payment terms;



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