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1.6 Thickness PCB Nanya FR4 Material 0.5 OZ-2.0 OZ Copper

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Accuracy Electronics Technologies Co.,Ltd
City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:MrsPauline gao
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1.6 Thickness PCB Nanya FR4 Material 0.5 OZ-2.0 OZ Copper

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Brand Name :ACCPCB
Model Number :P1090
Certification :ISO, UL, SGS,TS16949
Place of Origin :China
MOQ :1-5PCS
Price :Negotiable
Payment Terms :L/C / T/T / Western Union / Paypal
Supply Ability :50000SQ.M/PER MONTH
Delivery Time :12-16days
Packaging Details :Vacuum packaging
Material :FR4
Layer :10L
Surface Finish :Immersion Gold(Au:2u'')
Thickness :1.60mm
Min. hole size :0.1mm
Copper thickness :0.5 OZ--2.0OZ
Type :Electronic Board,Rigid board
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1.6 Thickness Impedance Control PCB Nanya FR4 Material 0.5 OZ-2.0 OZ Copper

Key Specifications/Special Features :

Base Material : FR4
Board Thickness : 1.60 mm
Layers : 10 layers
Copper thickness : 1 OZ For All Layer
Surface Finish : Immersion gold ( Au:2u'')
Impedance : 100Ohm
Min. Hole Size : 0.15 mm
Min. Line Width : 0.1mm/4mil
Min. Line Spacing : 4/4mil(0.1/0.1mm)
Capacity of Production : 50000Sq.m/month

Quality assurance :

Every production process has a special person to test to ensure quality, AOI, E-testing, Flying Probe Test.
Have professional engineers to check the quality
All products have passed CE, FCC, ROHS and other certifications

Application:
Widely used in stage, Industrila control,computer,consuming electronics,security,automotive,power electronics,medical,telecom etc.

Lead Time :

Lead Time 2 / L 4 / L 6 / L 8 / L
Sample Order 3-5days 6-8days 10-12days 12-14days
Mass Production 7-9days 8-10days 12-15days 15-18days

FAQ :

1. How do ACCPCB ensure quality?

Our high quality standard is achieved with the following.

1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process

2. What kinds of boards can ACCPCB process?

Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.


3. What data are needed for PCB production?

PCB Gerber files with RS-274-X format.


4. What’s the typical process flow for multi-layer PCB?

Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.


5. How many types of surface finish ACCPCB can do?

the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.

1.6 Thickness PCB Nanya FR4 Material 0.5 OZ-2.0 OZ Copper

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