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OEM 12 Layer High Current PCB Immersion Gold Green Solder Mask For Wireless Charger

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Accuracy Electronics Technologies Co.,Ltd
City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:MrsPauline gao
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OEM 12 Layer High Current PCB Immersion Gold Green Solder Mask For Wireless Charger

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Brand Name :ACCPCB
Model Number :P1009
Certification :ISO, UL, SGS,TS16949
Place of Origin :China
MOQ :20PCS
Price :Negotiable
Payment Terms :L/C / D/A / T/T / Western Union
Supply Ability :30,000SQ.M/PER MONTH
Delivery Time :8-15 Days
Packaging Details :Vacuum packing with desiccant
Material :FR4 TG170
Thickness :1.20mm
Number of layers :12 layer
Min. line spacing :0.1mm4mil)
Silkscreen color :White/black/yellow/red/blue
Surface finishing :ENIG
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OEM 12 Layer High Current PCB Immersion Gold Green Solder Mask For Wireless Charger

PCB Flow Chart.pdf

Production description :

this board is 12layer PCB it is used on wireless charger. PCB prototype,samll volum, middle and large volume are accepted. no MOQ request for new boards. All PCB are passed UL, TS16949, ROHS ,ISO9001 etc. Certification.

Key Specifications/Special Features :

Layer : 12 Layers
Base Material : KB FR4 TG170
Board Thickness : 1.60mm
Min. Hole Size : 6mil / 0.15mm
Min. Line Width : 4/4 mil
Min. Line Spacing : 4/4mil
Surface Finishing : Lead Free HAL
Solder Mask Color : Green
Certificate : UL, CQC, TS16949, ISO14000, ROHS
Silkscreen color : White
Outline : Routing + V-CUT

Rigid PCB Technical Capability:

Items Technical Capability
Layers 1-28 layers Min. line width/space 4mil

Max.board size (single&doule

sided)

600*1200mm Min.annular ring width: vias 3mil
Surface finish

HAL lead free,gold flash

Immersion silver,Immersion gold ,Immersion Sn,

hard gold,OSP,ect

Min.board thickness(multilayer) 4layers:0.4mm;
6layers:0.6mm;
8layers:1.0mm;
10layers:1.20mm
Board materials

FR-4; high Tg; high CTI; halogen free; high frequency(rogers,taconic,

PTFE,nelcon,

ISOLA,polyclad 370 HR); heavy copper,

Metal base clade laminate

Plating thickness (Technique:

Immersion Ni/Au)

Plating type: Imm Ni, Min./Max thickness:100/150U'' Plating type: Imm Au, Min./Max thickness:2/4U''
Impedance control ± 10%

Distance between

line to board edge

Outline: 0.2mm

V-CUT: 0.4mm

Base copper thickness(Inner

and outer layer)

Min. thickness: 0.5 OZ Max.thickness: 6OZ Min.hole size(board thickness ≥2mm) Aspect ratio≤16
Finished copper thickness Outer layers:
Min.thickness 1 OZ,
Max.thickness 10 OZ
Inner layers:
Min.thickness :0.5OZ,
Max.thickness : 6 OZ
Max.board thickness(single&doule sided) 3.20mm

Quality assurance :

Every production process has a special person to test to ensure quality, AOI and E-testing.

Have professional engineers to check the quality

All products have passed CE, FCC, ROHS and other certifications

Application:

Industril Control System
Power Supply
LED drive, LED Lighting
Communication Device
automotive electronics
Security Electronics
Household Control
Digital Appliances
Frequency converter
Medical Device

Shipping Information:
FOB Port : Hong Kong / Shenzhen Lead Time : 8 - 15 days
HTS Code : 8534.00.10 Dimensions per Carton : 37X27X22mm
Weight Per Carton : 20 Kilograms

FAQ :

1. How do ACCPCB ensure quality?

Our high quality standard is achieved with the following.

1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process

2. What kinds of boards can ACCPCB process?

Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.


3. What data are needed for PCB production?

PCB Gerber files with RS-274-X format.

4. How many types of surface finish ACCPCB can do?

the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.


5. What are the main factors which will affect the price of PCB?

Material;
Surface finish;

Board thickness, Copper thickness;
Technology difficulty;
Different quality criteria;
PCB characteristics;
Payment terms;

OEM 12 Layer High Current PCB Immersion Gold Green Solder Mask For Wireless Charger

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