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FR4 TG170 High TG PCB high temperature pcb and Size 65mmX40mm for control digital

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Accuracy Electronics Technologies Co.,Ltd
City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:MrsPauline gao
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FR4 TG170 High TG PCB high temperature pcb and Size 65mmX40mm for control digital

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Brand Name :ACCPCB
Model Number :P1011
Certification :ISO, UL, SGS,TS16949
Place of Origin :China
MOQ :20PCS
Price :Negotiable
Payment Terms :L/C, D/A, T/T, Western Union
Supply Ability :30,000SQ.M/PER MONTH
Delivery Time :9-12 Days
Packaging Details :Vacuum packing with desiccant
Material :FR4 TG170
Thickness :1.6mm
Application :Communication Equipments
Size :65mmX40mm
Surface finishing :ENIG
Number of layers :8 layer
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FR4 TG170 High TG PCB high temperature pcb and Size 65mmX40mm for control digital

Key Specifications/Special Features :

Layer : 8Layers
Base Material : FR4TG170
Copper Thickness : 2 / 1 / 1 / 1 / 1 / 1 / 2 oz
Board Thickness : 1.60mm
Min. Hole Size : 8mil / 0.2mm
Min. Line Width : 4/4 mil
Min. Line Spacing : 4/4mil
Surface Finishing : HAL
Solder Mask Color: Green
Certificate : UL, CQC, TS16949, ISO14000, ROHS
Company type : Manufacturer/ Factory
Silkscreen color : White
Outline : Routing,V-Groove, Beveling punch

Quality assurance :

Every production process has a special person to test to ensure quality, AOI and E-testing.

Have professional engineers to check the quality

All products have passed CE, FCC, ROHS and other certifications

Application:

Industril Control System
Power Supply
LED drive, LED Lighting
Communication Device
automotive electronics
Security Electronics
Household Control
Digital Appliances
Frequency converter
Medical Device

Technology Capability:

Item Technical Parameters
Layers 1-28 Layers
Inner Layer Min Trace/Space 4/4 mil
Out Layer Min Trace,Space 4/4 mil
Inner Layer Max Copper 4 OZ
Out Layer Max Copper 4 OZ
Inner Layer Min Copper 1/3 oz
Out Layer Min Copper 1/3 oz
Min hole size 0.15 mm
Max.board thickness 6 mm
Min.board thickness 0.2mm
Max.board size 680*1200 mm
PTH Tolerance +/-0.075mm
NPTH Tolerance +/-0.05mm
Countersink Tolerance +/-0.15mm
Board Thickness Tolerance +/-10%
Min BGA 7mil
Min SMT 7*10 mil
Solder mask bridge 4 mil
Solder mask color White,black,blue,green,yellow,red,etc
Legend color White,black,yellow,gray,etc
Surface finish HAL,OSP, Immersion Ni/Au ,Imm silver/SN,ENIG
Board materials FR-4;high TG;HighCTI; halogen free; Aluminum Bsed PCB,high frequency(rogers,isola),copper -base PCB
Impedance control +/-10%
Bow and twist ≤0.5

FAQ :

1. What data are needed for PCB production?

PCB Gerber files with RS-274-X format.

2. What kinds of boards can ACCPCB process?

Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.

3. What’s the typical process flow for multi-layer PCB?

Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.


4. How many types of surface finish ACCPCB can do?

the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.

5. How do ACCPCB ensure quality?

Our high quality standard is achieved with the following.

1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process


FR4 TG170 High TG PCB high temperature pcb and Size  65mmX40mm for control digital

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