Accuracy Electronics Technologies Co.,Ltd

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Green Solder Mask FR4 TG150 Lead Free PCB Board

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Accuracy Electronics Technologies Co.,Ltd
City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:MrsPauline gao
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Green Solder Mask FR4 TG150 Lead Free PCB Board

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Brand Name :ACCPCB
Model Number :S1207126
Certification :ISO, UL, SGS,TS16949
Place of Origin :China
MOQ :1PCS
Price :Negotiable
Payment Terms :L/C / T/T / Western Union / Paypal
Delivery Time :10-12days
Packaging Details :Vacuum packing with desiccant
Product Name :Multilayer Rigid boards
Thickness :1.60mm
Size :200mmX160mm
Min. line spacing :0.1MM / 4MIL
Board thickness :0.5~3.2mm
Surface finishing :HAL LEAD FREE, Immersion gold,immersion silver /TIN
Copper thickness :0.5oz-6oz
Min Line spacing :4mil (0.1mm)
Min.line width :4 mil ( 0.1mm)
Min Drill Hole size :0.2mm
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View Product Description

FR4 TG150 material Lead free PCB board green soldermask for power supply

Key Specifications of amplifier PCB board:

Production Types: Rigid PCB
Layer : 3 layer
Base Material : FR4 tg150
Copper Thickness : 1 oz
Board Thickness : 1.60mm
Min. Finish Hole Size : 8 mil (0.10mm)
Min. Line Width : 4 mil
Min. Line Spacing : 4 mil
Surface Finishing : ENIG,OSP,HASL,Immersion Gold,Gold Plating
Drilling hole tolerance: +/-3 mil ( 0.075mm )
Min Outline tolerance : +/-4 mil ( 0.10mm )
Working panel size : max:1200mmX600mm (47'' X24'')
Outline profile: Punching, Routing , CNC routing + V-cut
Solder mask : LPI Solder mask, Peelable mask
Solder Mask Color : Blue, black,yellow, matte green
Certificate : UL, CQC, TS16949, ISO14000, ROHS
Silkscreen color : White
Twist and Bow : no more than 0.75 %

PCB Chart.pdf

Products Application:

1, Telecom Communication :wireless LAN card, XDSL router,Servers, Optical Device,Hard Drive etc;

2, Consumer Electronics: TV, DVD,Digital Caramer, air conditoner, Refrigerator,set-top box etc;

3, Security monitor: Moible phone, PDA, GPS, caramer monitor etc;

4, Vehicle Electronices: Car etc;

5, Smart Home: Wearable device ,computers, ipad , Remote Control etc;

6, Industrial controls: Medical device ,UPS equipment, Control device etc;

7, Military & Defense : Military Weapons etc;

Advantages :
• Strict product liability, taking IPC-A-160 standard
• Engineering pretreatment before production
• Production process control (5Ms)
• 100% E-test, 100% visual inspection, including IQC, IPQC, FQC, OQC
• 100% AOI inspection, including X-ray, 3D microscope and ICT
• High-voltage test, impedance control test
• Micro section, soldering capacity, thermal stress test, shocking test
• In-house PCB production
• No minimum order quantity and free sample
• Focus on low to medium volume production
• Quick and on-time delivery

Technical Capability:

ITEMS Capability
Max. layer count 28L
Min. line widty 0.08mm
Min. line spacing 0.08mm
Min. hole size 0.15mm
Board thickness 0.4-6.0mm
Max. boardsize 520×620mm
(PTH) Hole size tolerance(PTH) ±0.075mm
(NPTH) Hole size tolerance(NPTH) ) ±0.05mm
Holeposition tolerance(Routing) ±0.1mm
Outline tolerance(Punching) ±0.1mm

Green Solder Mask FR4 TG150 Lead Free PCB Board

FAQ:

1. How do ACCPCB ensure quality?

Our high quality standard is achieved with the following.

1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process

2. What data are needed for PCB production?

PCB Gerber files with RS-274-X format.

3. What kinds of boards can ACCPCB process?

Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.

4. How many types of surface finish ACCPCB can do?

the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.


5. What are the main factors which will affect the price of PCB?

Material;
Surface finish;

Board thickness, Copper thickness;
Technology difficulty;
Different quality criteria;
PCB characteristics;
Payment terms;

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