Accuracy Electronics Technologies Co.,Ltd
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OEM Electronics 10 Layer FR4 Tg150 Multilayer PCB Board 1.58mm Thickness
Production description :
this board is 10 layer with 2 oz copper thickness.PCB prototype,samll volum, middle and large volume are accepted. no MOQ request for new order. all of these boards are met UL,TS16949, ISO9001 Etc.
Key Specifications/Special Features :
| Layer : | 10 Layers |
| Base Material : | FR4 tg150 |
| Copper Thickness : | 2oz in all layer |
| Board Thickness : | 1.58mm |
| Min. Hole Size : | 8 mil |
| Min. Line Width : | 6 mil |
| Min. Line Spacing : | 6 /mil |
| Surface Finishing : | immersion gold |
| Solder Mask Color : | Green |
| Certificate : | UL, CQC, TS16949, ISO14000, ROHS |
| Silkscreen color : | White |
| Outline profile : | Routing, punching |
| Twist and bow : | 0.75% |
| Immpedance control : | +/- 10% |
| Solder mask : | LPI solder mask, peelable mask |
ACCPCB Technical Capability.pdf
Products Application:
1, Consumer Electronics: TV, DVD,Digital Caramer, air conditoner, Refrigerator,set-top box etc;
2, Security monitor: Moible phone, PDA, GPS, caramer monitor etc;
3, Telecom Communication :wireless LAN card, XDSL router,Servers, Optical Device,Hard Drive etc;
4, Industrial controls: Medical device ,UPS equipment, Control device etc;
5, Vehicle Electronices: Car etc;
6, Military & Defense : Military Weapons etc;
1. What data are needed for PCB production?
PCB Gerber files with RS-274-X format.
2. How do ACCPCB ensure quality?
Our high quality standard is achieved with the following.
1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process
3. How many types of surface finish ACCPCB can do?
O-the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.
4. What’s the typical process flow for multi-layer PCB?
Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.