Accuracy Electronics Technologies Co.,Ltd
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Six layer FR4 Tg180 TS 16949 HDI PCB Board 1oz Copper Thickness
Production description :
this board is 6 layer. it is used for Car. we can accept any quantity. all of our PCB are met UL, TS 16949,ROHS, ISO Etc. certification. no MOQ request for new order.
Production Feature:
| Layer : | 6Layers |
| Base Material : | FR4 Tg180 |
| Copper Thickness : | 1oz in all layer |
| Board Thickness : | 1.62 mm |
| Surface Finish : | Immersion gold |
| Min. Hole Size : | 6 mil, 0.15mm |
| Min. Line Width : | 4/4 mil, 0.10/0.10 mm |
| Min. Line Spacing : | 4/4mil, 0.10/0.10mm |
| Application : | Switch device |
| Certification : | ISO9001, UL, ROHS,TS16949 |
| Outline profile: | Punching, Routing , CNC routing + V-cut |
| Solder mask : | LPI Solder mask, Peelable mask |
| Solder Mask Color : | Blue, black,yellow, matte green |
| Certificate : | UL, CQC, TS16949, ISO14000, ROHS |
| Twist and Bow : | no more than 0.75 % |
PCB Flow Chart.pdf
Products Application:
1, Telecom Communication
2, Consumer Electronics
3, Security monitor
4, Vehicle Electronices
5, Smart Home
6, Industrial controls
7, Military & Defense
FAQ :
1. How do ACCPCB ensure quality?
Our high quality standard is achieved with the following.
1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process
2. What kinds of boards can ACCPCB process?
Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.
3. What data are needed for PCB production?
PCB Gerber files with RS-274-X format.
4. What’s the typical process flow for multi-layer PCB?
Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.