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Rigid ENIG High Frequency PCB Board Green Solder Mask 0.80mm Thickness
Production description :
customized frequency circuit board. we can accept PCB prototype,samll volum, middle and large volume. no MOQ request for new order. for repeat order, just meet 3sq.m.
Key Specifications of PCB:
Production Types: | Rigid PCB |
Layer : | 4 layer |
Base Material : | KB FR4 |
Copper Thickness : | 1 oz |
Board Thickness : | 0.80 mm |
Min. Finish Hole Size : | 8 mil (0.10mm) |
Min. Line Width : | 4 mil |
Min. Line Spacing : | 4 mil |
Surface Finishing : | ENIG |
Drilling hole tolerance: | +/-3 mil ( 0.075mm ) |
Min Outline tolerance : | +/-4 mil ( 0.10mm ) |
Working panel size : | max:1200mmX600mm (47'' X24'') |
Outline profile: | Punching, Routing , CNC routing + V-cut |
Solder mask : | LPI Solder mask, Peelable mask |
Solder Mask Color : | Blue, black,yellow, matte green |
Certificate : | UL, CQC, TS16949, ISO14000, ROHS |
Silkscreen color : | White |
Twist and Bow : | no more than 0.75 % |
Rigid PCB Technical Capability:
Items | Technical Capability | ||
Layers | 1-28 layers | Min. line width/space | 4mil |
Max.board size (single&doule sided) | 600*1200mm | Min.annular ring width: vias | 3mil |
Surface finish | HAL lead free,gold flash Immersion silver,Immersion gold ,Immersion Sn, hard gold,OSP,ect | Min.board thickness(multilayer) | 4layers:0.4mm; 6layers:0.6mm; 8layers:1.0mm; 10layers:1.20mm |
Board materials | FR-4; high Tg; high CTI; halogen free; high frequency(rogers,taconic, PTFE,nelcon, ISOLA,polyclad 370 HR); heavy copper, Metal base clade laminate | Plating thickness (Technique: Immersion Ni/Au) | Plating type: Imm Ni, Min./Max thickness:100/150U'' Plating type: Imm Au, Min./Max thickness:2/4U'' |
Impedance control | ± 10% | Distance between line to board edge | Outline: 0.2mm V-CUT: 0.4mm |
Base copper thickness(Inner and outer layer) | Min. thickness: 0.5 OZ Max.thickness: 6OZ | Min.hole size(board thickness ≥2mm) | Aspect ratio≤16 |
Finished copper thickness | Outer layers: Min.thickness 1 OZ, Max.thickness 10 OZ Inner layers: Min.thickness :0.5OZ, Max.thickness : 6 OZ | Max.board thickness(single&doule sided) | 3.20mm |
Products Application:
1, Security monitor: Moible phone, PDA, GPS, caramer monitor etc;
2, Telecom Communication :wireless LAN card, XDSL router,Servers, Optical Device,Hard Drive etc;
3, Consumer Electronics: TV, DVD,Digital Caramer, air conditoner, Refrigerator,set-top box etc;
4, Vehicle Electronices: Car etc;
5, Industrial controls: Medical device ,UPS equipment, Control device etc;
6, Military & Defense : Military Weapons etc;
Lead Time :
Lead Time | 2 /L | 4 /L | 6/ L | 8/ L |
Sample Order | 3-5days | 6-8days | 10-12days | 12-14days |
Mass Production | 7-9days | 8-10days | 12-15days | 15-18days |
FAQ :
1. How many types of surface finish ACCPCB can do?
ACCPCB has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.
2. What kinds of boards can ACCPCB process?
Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.
3. What data are needed for PCB production?
PCB Gerber files with RS-274-X format.
4. How do you make the impedance calculation?
The impedance control system is done using some test coupons, the SI6000 soft and the CITS 500s equipment.